About the Journal

Focus and Coverage

Applied Physics Letters, published by the American Institute of Physics, features concise, up-to-date reports on significant new findings in applied physics. Emphasizing rapid dissemination of key data and new physical insights, Applied Physics Letters offers prompt publication of new experimental and theoretical papers bearing on applications of physics phenomena to all branches of science, engineering, and modern technology. Content is published online daily, collected into weekly online and printed issues (52 issues per year).

2011 Journal Citation Reports® (Thomson Reuters, 2012)*:
Applied Physics Letters retains top spot as most highly cited journal in Applied Physics (Thomson Reuters, 2012)
 

* Data from the 2011 Journal Citation Reports^® Science Edition (Thomson Reuters, 2012).

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Editors

Editor

Nghi Q. Lam
Argonne National Laboratory, Argonne, IL, USA

Senior Associate Editor

David Long Price (CNRS-Centre de Recherche sur les Matériaux à Haute Température, Orleans, France)

Associate Editors

Orlando Auciello (The University of Texas at Dallas, Richardson, TX, USA)

Samuel D. Bader (Argonne National Laboratory, Argonne, IL, USA)

Dongmin Chen (Peking University, Beijing, China)

Fabrizio Cleri (Université des Sciences et Technologies de Lille, France)

Hong-Jun Gao (Institute of Physics, Chinese Academy of Sciences, Beijing, China)

Christoph H. Grein (University of Illinois at Chicago, Chicago, IL, USA)

Qing Hu (Massachusetts Institute of Technology, Cambridge, MA, USA)

David S. Kupperman (Argonne National Laboratory, Argonne, IL, USA)

Shuit-Tong Lee (Soochow University, Suzhou, China)

Minn-Tsong Lin (National Taiwan University, Taipei, Taiwan)

Kenjiro Miyano (National Institute for Materials Science, Tsukuba, Japan)

Paul R. Okamoto  (Argonne National Laboratory, Argonne, IL, USA)

Lynn E. Rehn (Argonne National Laboratory, Argonne, IL, USA)

Susan E. Trolier-McKinstry  (Pennsylvania State University, University Park, PA, USA)

Linda Young (Argonne National Laboratory, Argonne, IL, USA)

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Editorial Board

• Term ending 31 December 2013

  David G. Cahill (University of Illinois, Urbana, IL, USA)
  Shangjr Gwo (National Tsing-Hua University, Hsinchu, Taiwan)
  Judith L. MacManus-Driscoll (University of Cambridge, Cambridge, United Kingdom)
  Tae Won Noh (Seoul National University, Seoul, Republic of Korea)
  Alain Polian (Université Pierre et Marie Curie, Paris, France)

• Term ending 31 December 2014

  Demetre J. Economou (University of Houston, Houston, TX, USA)
  Todd C. Hufnagel (Johns Hopkins University, Baltimore, MD, USA)
  Philip Kim (Columbia University, New York, NY, USA)
  Karl Leo (Technische Universitaet Dresden and Fraunhofer-COMEDD, Dresden, Germany)
  Dmitri E. Nikonov (Intel Corporation, Hillsboro, OR, USA)
  Caroline A. Ross (Massachusetts Institute of Technology, Cambridge, MA, USA)
  Rui-Qin Zhang (City University of Hong Kong, Hong Kong SAR, China)

• Term ending 31 December 2015

  Yasuhiko Arakawa (University of Tokyo, Tokyo, Japan)
  Cid B. de Araújo (Universidade Federal de Pernambuco, Recife, Brazil)
  Xi-Qiao Feng (Tsinghua University, Beijing, China)
  Kevin L. Jensen (Naval Research Laboratory, Washington, DC, USA)
  Sergei V. Kalinin (Oak Ridge National Laboratory, Oak Ridge, TN, USA)
  Beatriz Noheda (University of Groningen, Groningen, The Netherlands)
  James S. Speck (University of California, Santa Barbara, CA, USA)

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Editorial Office

Contact the APL Editorial Office at:

Applied Physics Letters
American Institute of Physics
Suite 1NO1
2 Huntington Quadrangle
Melville, NY 11747-4502, USA
 
Telephone: 516-576-2344
E-mail: apl-edoffice@aip.org
 

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AIP Production Office

Authors of accepted manuscripts may contact the AIP Production Office at:

Editorial Supervisor
Applied Physics Letters
American Institute of Physics
Suite 1NO1
2 Huntington Quadrangle
Melville, NY 11747-4502, USA
 
Telephone: +1 516-576-2345/2371/2417
Fax: +1 516-576-2233
E-mail: apl@aip.org

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ISSN and CODEN

Print: ISSN 0003-6951
Online: ISSN 1077-3118
 

CODEN: APPLAB

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