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Appl. Phys. Lett. 90, 232112 (2007); http://dx.doi.org/10.1063/1.2747183 (3 pages)
Study of the thermal stress in a Pb-free half-bump solder joint under current stressing
(Received 15 January 2007; accepted 16 May 2007; published online 7 June 2007)
© 2007 American Institute of Physics
KEYWORDS and PACS
ReferencesK. N. Tu, J. Appl. Phys. 94, 5451 (2003)JAPIAU000094000009005451000001.
A. T. Huang, A. M. Gusak, K. N. Tu, and Y. S. Lai, Appl. Phys. Lett. 88, 141911 (2006)APPLAB000088000014141911000001.
S. H. Chiu, T. L. Shao, C. Chen, D. J. Yao, and C. Y. Hsu, Appl. Phys. Lett. 88, 022110 (2006)APPLAB000088000002022110000001.
D. C. Yeh and H. B. Huntington, Phys. Rev. Lett. 53, 1469 (1984).
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