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Appl. Phys. Lett. 100, 013504 (2012); http://dx.doi.org/10.1063/1.3674287 (3 pages)

Gallium oxide (Ga2O3) metal-semiconductor field-effect transistors on single-crystal β-Ga2O3 (010) substrates

Masataka Higashiwaki1,2, Kohei Sasaki3, Akito Kuramata3, Takekazu Masui4, and Shigenobu Yamakoshi3

1National Institute of Information and Communications Technology, 4–2–1 Nukui-kitamachi, Koganei, Tokyo 184–8795, Japan
2PRESTO, Japan Science and Technology Agency (JST), 7 Gobancho, Chiyoda, Tokyo 102–0075, Japan
3Tamura Co., Ltd., 2–3–1 Hirosedai, Sayama, Saitama 350–1328, Japan
4Koha Co., Ltd., 2–6–8 Kouyama, Nerima, Tokyo 176–0022, Japan

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(Received 17 November 2011; accepted 6 December 2011; published online 4 January 2012)

We report a demonstration of single-crystal gallium oxide (Ga2O3) metal-semiconductor field-effect transistors (MESFETs). A Sn-doped Ga2O3 layer was grown on a semi-insulating β-Ga2O3 (010) substrate by molecular-beam epitaxy. We fabricated a circular MESFET with a gate length of 4 μm and a source–drain spacing of 20 μm. The device showed an ideal transistor action represented by the drain current modulation due to the gate voltage (VGS) swing. A complete drain current pinch-off characteristic was also obtained for VGS < −20 V, and the three-terminal off-state breakdown voltage was over 250 V. A low drain leakage current of 3 μA at the off-state led to a high on/off drain current ratio of about 10 000. These device characteristics obtained at the early stage indicate the great potential of Ga2O3-based electrical devices for future power device applications.

© 2012 American Institute of Physics

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0003-6951 (print)  
1077-3118 (online)

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