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Applied Physics Letters / Volume 101 / Issue 13 / STRUCTURAL, MECHANICAL, OPTICAL, AND THERMODYNAMIC PROPERTIES OF ADVANCED MATERIALS

Appl. Phys. Lett. 101, 131901 (2012); http://dx.doi.org/10.1063/1.4754607 (4 pages)

Laser triggered sequential folding of microstructures

Kate E. Laflin1, Christopher J. Morris2, Tanziyah Muqeem3, and David H. Gracias1,4

1Department of Chemical and Biomolecular Engineering, Johns Hopkins University, Baltimore, Maryland 21218, USA
2The U.S. Army Research Laboratory, 2800 Powder Mill Road, Adelphi, Maryland 20783, USA
3Department of Biomedical Engineering, Johns Hopkins University, Baltimore, Maryland 21218, USA
4Department of Chemistry, Johns Hopkins University, Baltimore, Maryland 21218, USA

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(Received 2 June 2012; accepted 6 September 2012; published online 24 September 2012)

In order to fabricate complex origami inspired devices, it is necessary to control folding pathways and enable sequential folding. We demonstrate sequential folding of microstructures from afar by the directed heating of pre-stressed hinges using low power, 40–80 mW handheld, commercial lasers. We observed that the hinge-actuation and consequently folding time varied with laser irradiance, wavelength, and distance. We highlight possible applications by sequential folding of patterned and nested microstructures.

© 2012 American Institute of Physics

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KEYWORDS, PACS, and IPC

Keywords

hinges, microfabrication, micromechanical devices

PACS

  • 07.10.Cm

    Micromechanical devices and systems

International Patent Classification (IPC)

  • B81B

    Micro-structural devices or systems, e.g. micro-mechanical devices

  • B81C1/00

    Manufacture or treatment of devices or systems in or on a substrate

  • E05D

    Hinges or other suspension devices for doors, windows, or wings

ARTICLE DATA

Digital Object Identifier
http://dx.doi.org/10.1063/1.4754607

PUBLICATION DATA

ISSN

0003-6951 (print)  
1077-3118 (online)

Publisher

$abstract.society.value is a Member of CrossRef American Institute of Physics

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    References

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    J. Ryu, M. D'Amato, X. Cui, K. N. Long, H. J. Qi, and M. L. Dunn, Appl. Phys. Lett. 100, 161908 (2012)APPLAB000100000016161908000001.

    A. J. Birnbaum and A. Pique, Appl. Phys. Lett. 98, 134101 (2011)APPLAB000098000013134101000001.

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    G. P. Nikishkov, J. Appl. Phys. 94, 5333 (2003)JAPIAU000094000008005333000001.


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