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9 Mar 1987

Volume 50, Issue 10, pp. 551-625

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Direct and accurate measurement of etch rate of polymer films under far‐UV irradiation

Sylvain Lazare, Jean Claude Soulignac, and Pascal Fragnaud

Appl. Phys. Lett. 50, 624 (1987); http://dx.doi.org/10.1063/1.98101 (2 pages) | Cited 26 times

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We have developed a new technique for measuring the etch rate of polymer films under ablative photodecomposition condition obtained by absorption of the far‐UV radiation of the excimer laser. The technique is based on the use of a quartz crystal microbalance interfaced with a microcomputer. It has good accuracy and thus provides precise evidence of a new feature of the etch curve for laser intensity right above the ablation threshold value. Further applications are proposed.
Show PACS
81.05.Lg Polymers and plastics; rubber; synthetic and natural fibers; organometallic and organic materials
81.65.-b Surface treatments
79.20.Ds Laser-beam impact phenomena
82.50.Hp Processes caused by visible and UV light
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