Dislocation reduction in GaN films grown on sapphire and silicon substrates was achieved by inserting thin InGaN layers grown in a selective island growth mode after partial passivation of the GaN surface with a submonolayer of silicon nitride. We show that this technique is most effective at reducing the pure edge dislocation density when it is high (i.e., >1010 cm−2)
and less when the density is in the 108–109 cm−2
range. Thus, the structural quality of typically highly dislocated GaN on silicon films could be significantly improved, visible in a reduction of the (0002) full width at half maximum (FWHM) from 1300 arcsec for ordinary GaN on silicon to 800 arcsec for GaN films with silicon nitride/InGaN interlayers. In the case of GaN layers grown on sapphire (dislocation density ∼ 109 cm−2),
the method resulted mainly in a reduction of the FWHM of the (102)
diffraction peaks. © 2000 American Institute of Physics.