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Appl. Phys. Lett. 77, 4425 (2000); http://dx.doi.org/10.1063/1.1332103 (3 pages)
Investigating material and functional properties of static random access memories using cantilevered glass multiple-wire force-sensing thermal probes
(Received 17 July 2000; accepted 13 October 2000)
© 2000 American Institute of Physics
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KEYWORDS and PACS
Keywords
SRAM chips, integrated circuit measurement, thermal conductivity measurement, thermal resistance measurement, scanning probe microscopy, surface topography measurement, inspection, thermocouples, force sensors
PACS
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Pulse and digital circuits
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Microcircuit quality, noise, performance, and failure analysis
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Atomic force microscopes
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Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing
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Thermal instruments and apparatus
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Spatial dimensions (e.g., position, lengths, volume, angles, and displacements)
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Instruments for strain, force, and torque
ARTICLE DATA
References
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