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Applied Physics Letters / Volume 81 / Issue 3 / INTERDISCIPLINARY AND GENERAL PHYSICS

Appl. Phys. Lett. 81, 562 (2002); http://dx.doi.org/10.1063/1.1493226 (3 pages)

Additive, nanoscale patterning of metal films with a stamp and a surface chemistry mediated transfer process: Applications in plastic electronics

Yueh-Lin Loo, Robert L. Willett, Kirk W. Baldwin, and John A. Rogers

Bell Laboratories, Lucent Technologies, Murray Hill, New Jersey 07974

(Received 14 February 2002; accepted 16 May 2002)

We describe a method for contact printing metal patterns with nanometer features over large areas. This nanotransfer printing (nTP) technique relies on tailored surface chemistries to transfer metal films from the raised regions of a stamp to a substrate when these two elements are brought into intimate physical contact. The printing is purely additive, fast (<15 s contact time), and it occurs in a single processing step at ambient conditions. Features of varying dimensions, including sizes down to ∼ 100 nm, can be printed with edge resolution better than 15 nm. Electrical contacts and interconnects for high-performance organic transistors and complementary inverter circuits have been successfully fabricated using nTP. © 2002 American Institute of Physics.

© 2002 American Institute of Physics

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KEYWORDS and PACS

Keywords

nanotechnology, electrical contacts, integrated circuit interconnections

PACS

  • 81.16.Rf

    Micro- and nanoscale pattern formation

  • 85.40.Ls

    Metallization, contacts, interconnects; device isolation

ARTICLE DATA

Digital Object Identifier
http://dx.doi.org/10.1063/1.1493226

PUBLICATION DATA

ISSN

0003-6951 (print)  
1077-3118 (online)

Publisher

$abstract.society.value is a Member of CrossRef American Institute of Physics

For access to fully linked references, you need to log in.
    A. Kumar and G. M. Whitesides, Appl. Phys. Lett. 63, 2002 (1993)APPLAB000063000014002002000001.

    J. A. Rogers, R. J. Jackan, G. M. Whitesides, J. L. Wagener, and A. M. Vengsarkar, Appl. Phys. Lett. 70, 7 (1997)APPLAB000070000001000007000001.

    M. Nakamura, S. Kato, T. Aoki, L. Sirghi, and Y. Hatanaka, J. Appl. Phys. 90, 3391 (2001)JAPIAU000090000007003391000001.

    W. Zhang and S. Y. Chou, Appl. Phys. Lett. 79, 845 (2001)APPLAB000079000006000845000001.


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