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14 Jun 2004

Volume 84, Issue 24, pp. 4839-5046

Issue Cover Spotlight Figure

Appl. Phys. Lett. 84, 4409 (2004); http://dx.doi.org/10.1063/1.1757648 (3 pages)

Azita Soleymani, Piroz Zamankhan, and William Polashenski
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Electromechanically induced transition from nonohmic to ohmic behavior at contact interfaces

L. Kogut and K. Komvopoulos

Appl. Phys. Lett. 84, 4842 (2004); http://dx.doi.org/10.1063/1.1757633 (3 pages) | Cited 10 times

Online Publication Date: 25 May 2004

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A straightforward method for removing thin insulating films from contact interfaces of conductive surfaces that enables changing the contact behavior from nonohmic to ohmic was derived in this study. The efficacy of this method is demonstrated by experiments performed with a special microdevice consisting of polysilicon. It is shown that the native oxide film can be removed from asperity nanocontacts at the contact interface by electromechanical means without damaging the microdevice. Measurements of electrical contact resistance versus applied current are used to characterize the contact interface. The present approach for removing oxide surface films that are responsible for the nonohmic behavior at microdevice contact interfaces is straightforward and can easily be applied to other types of miniaturized devices to enhance their reliability and performance. An additional benefit of this method is the release of adhered microdevices by nondestructive means. © 2004 American Institute of Physics.
Show PACS
73.61.Cw Elemental semiconductors
84.32.Dd Connectors, relays, and switches
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
73.63.Rt Nanoscale contacts
73.40.Ns Metal-nonmetal contacts
73.40.Cg Contact resistance, contact potential
64.70.K- Solid-solid transitions

Overheating threshold and its effect on time–temperature-transformation diagrams of zirconium based bulk metallic glasses

S. Mukherjee, Z. Zhou, J. Schroers, W. L. Johnson, and W. K. Rhim

Appl. Phys. Lett. 84, 5010 (2004); http://dx.doi.org/10.1063/1.1763219 (3 pages) | Cited 16 times

Online Publication Date: 28 May 2004

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A pronounced effect of overheating is observed on the crystallization behavior for the three zirconium-based bulk metallic glasses: Zr41.2Ti13.8Cu12.5Ni10Be22.5, Zr57Cu15.4Ni12.6Al10Nb5, and Zr52.5Cu17.9Ni14.6Al10Ti5. A threshold overheating temperature is found for each of the three alloys, above which there is a drastic increase in the undercooling level and the crystallization times. Time–temperature-transformation (TTT) diagrams were measured for the three alloys by overheating above their respective threshold temperatures. The TTT curves for Zr41.2Ti13.8Cu12.5Ni10Be22.5 and Zr57Cu15.4Ni12.6Al10Nb5 are very similar in shape and scale with their respective glass transition temperatures, suggesting that system-specific properties do not play a crucial role in defining crystallization kinetics in these alloys. The critical cooling rates to vitrify the alloys as determined from the TTT curves are about 2 K/s for Zr41.2Ti13.8Cu12.5Ni10Be22.5 and 10 K/s for Zr57Cu15.4Ni12.6Al10Nb5. The measurements were conducted in a high-vacuum electrostatic levitator. © 2004 American Institute of Physics.
Show PACS
81.40.Gh Other heat and thermomechanical treatments
81.30.Hd Constant-composition solid-solid phase transformations: polymorphic, massive, and order-disorder
61.43.Fs Glasses
64.70.K- Solid-solid transitions
81.05.Kf Glasses (including metallic glasses)
64.70.P- Glass transitions of specific systems
64.70.Q- Theory and modeling of the glass transition
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