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18 Oct 2004

Volume 85, Issue 16, pp. 3343-3639

Issue Cover Spotlight Figure

Appl. Phys. Lett. 85, 3570 (2004); http://dx.doi.org/10.1063/1.1807953 (2 pages)

X. N. Zhang, C. R. Li, Z. Zhang, and Z. X. Cao
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Microfluidic method for in-situ deposition and precision patterning of thin-film metals on curved surfaces

Edgar D. Goluch, Kashan A. Shaikh, Kee Ryu, Jack Chen, Jonathan Engel, and Chang Liu

Appl. Phys. Lett. 85, 3629 (2004); http://dx.doi.org/10.1063/1.1808872 (3 pages) | Cited 10 times

Online Publication Date: 22 October 2004

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We present a technique for patterning thin-film metals (silver and gold) without the need for photolithography. The technique involves microfluidics and can be performed on planar or curved surfaces. Patterns of thin-film metal are fabricated by flowing electroless silver or gold plating solutions through predefined microchannels made of polydimethylsiloxane sealed against a surface of interest. We demonstrate metal resistors with 100-μm-wide traces fabricated on planar and curved surfaces. The surface profile, mechanical gauge factor, and temperature coefficient of resistance have been characterized. Application of the resistors as hot-wire flow sensors has also been demonstrated.
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85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
84.32.Ff Conductors, resistors (including thermistors, varistors, and photoresistors)
81.15.Pq Electrodeposition, electroplating
68.55.A- Nucleation and growth
68.55.-a Thin film structure and morphology

Experimental evidence of redistribution of fields during processing in a high-power microwave cavity

D. C. Dube, P. D. Ramesh, J. Cheng, M. T. Lanagan, D. Agrawal, and R. Roy

Appl. Phys. Lett. 85, 3632 (2004); http://dx.doi.org/10.1063/1.1806542 (3 pages) | Cited 11 times

Online Publication Date: 22 October 2004

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A sensing probe has been introduced to profile the magnetic fields in a 2.45 GHz, high-power single-mode microwave cavity. The treatment of a ferrite sample inside the cavity has established that, during the heating process, there is an unusual concentration of a magnetic field around the sample. During field heating, intense magnetic fields have been monitored, and are analogous to the redistribution of an electric field reported by Riedel and Svoboda [Proceedings of the Eighth Ampere Conference and Microwave Heating (2001)] in their simulation studies on microwave sintering.
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84.40.Az Waveguides, transmission lines, striplines
75.50.Gg Ferrimagnetics
81.20.Ev Powder processing: powder metallurgy, compaction, sintering, mechanical alloying, and granulation
07.07.Df Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing
81.40.Gh Other heat and thermomechanical treatments

Shape-and-solder-directed self-assembly to package semiconductor device segments

Wei Zheng and Heiko O. Jacobs

Appl. Phys. Lett. 85, 3635 (2004); http://dx.doi.org/10.1063/1.1807017 (3 pages) | Cited 22 times

Online Publication Date: 22 October 2004

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The self-assembly and packaging of integrated semiconductor device segments have been accomplished by combining geometrical shape recognition with site specific wetting and binding involving liquid solder. Components with complementary shapes were fabricated to recognize and encapsulate functional semiconductor devices. The components were suspended in water and agitated using a pulsating liquid flow. Two hundred AlGaN∕GaN light-emitting diodes with a chip size of 380×330 micrometers were assembled and packaged with a yield of 95% in 2 min. The self-assembly procedure forms electrical interconnects between three-dimensionally shaped objects and provides a route to parallel assembly of hybrid microsystems.
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85.60.Jb Light-emitting devices
85.30.Kk Junction diodes
81.16.Dn Self-assembly
85.40.Ls Metallization, contacts, interconnects; device isolation
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