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Appl. Phys. Lett. 86, 201901 (2005); doi:10.1063/1.1928316 (3 pages)

Outdiffusion of La and Al from amorphous LaAlO3 in direct contact with Si (001)

P. Sivasubramani1, M. J. Kim1, B. E. Gnade1, R. M. Wallace1, L. F. Edge2, D. G. Schlom2, H. S. Craft3, and J.-P. Maria3

1Department of Electrical Engineering and Physics, University of Texas at Dallas, Richardson, Texas 75080
2Department of Materials Science and Engineering, Pennsylvania State University, University Park, Pennsylvania 16802
3Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27606

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(Received 26 January 2005; accepted 19 April 2005; published online 9 May 2005)

We have evaluated the thermal stability of Al2O3/LaAlO3/Si (001) stacks with atomic force microscopy, x-ray diffraction, transmission electron microscopy, and secondary ion mass spectrometry using a back side polishing approach. Crystallization of the amorphous LaAlO3 film was found to occur for rapid thermal anneals (RTA) above 935 °C for 20 s, in flowing N2. Penetration of Al and La into the underlying Si (001) is clearly observed for RTA at or above 950 °C for 20 s in flowing N2.

© 2005 American Institute of Physics

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KEYWORDS and PACS

PACS

  • 77.84.Bw

    Elements, oxides, nitrides, borides, carbides, chalcogenides, etc.

  • 77.55.-g

    Dielectric thin films

  • 66.30.-h

    Diffusion in solids

  • 68.37.Ps

    Atomic force microscopy (AFM)

  • 61.43.Er

    Other amorphous solids

  • 81.65.Ps

    Polishing, grinding, surface finishing

  • 61.72.Cc

    Kinetics of defect formation and annealing

  • 79.20.Rf

    Atomic, molecular, and ion beam impact and interactions with surfaces

  • 68.37.Lp

    Transmission electron microscopy (TEM)

PUBLICATION DATA

ISSN:

0003-6951 (print)  
1077-3118 (online)

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