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Applied Physics Letters / Volume 86 / Issue 20 / STRUCTURAL, MECHANICAL, THERMODYNAMIC, AND OPTICAL PROPERTIES OF CONDENSED MATTER

Appl. Phys. Lett. 86, 201902 (2005); http://dx.doi.org/10.1063/1.1925784 (3 pages)

Rapid lateral solidification of pure Cu and Au thin films encapsulated in SiO2

J. E. Kline and J. P. Leonard

Department of Materials Science and Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania 15261

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(Received 23 November 2004; accepted 25 March 2005; published online 9 May 2005)

Excimer laser melting and lateral resolidification is demonstrated in 200 nm thick Cu and Au elemental metal thin films encapsulated between SiO2 layers. Projection irradiation is used to selectively and completely melt lines 3 to 30 μm wide in the metal film—with rapid lateral solidification originating from the unmelted sidewalls of the molten region—resulting in large columnar grains, extending transversely to the middle of the line. Transmission electron microscopy reveals twinning structures and other defects typical of rapid solidification. Encapsulation and control of the fluence are found to be crucial parameters necessary to prevent film dewetting while molten.

© 2005 American Institute of Physics

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KEYWORDS and PACS

Keywords

copper, gold, silicon compounds, metallic thin films, transmission electron microscopy, rapid solidification, laser materials processing, encapsulation, twinning, melting, wetting

PACS

ARTICLE DATA

Digital Object Identifier
http://dx.doi.org/10.1063/1.1925784

PUBLICATION DATA

ISSN

0003-6951 (print)  
1077-3118 (online)

Publisher

$abstract.society.value is a Member of CrossRef American Institute of Physics

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