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12 Sep 2005

Volume 87, Issue 11, Articles (11xxxx)

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Appl. Phys. Lett. 87, 113902 (2005); http://dx.doi.org/10.1063/1.2045549 (3 pages)

M. Laroussi and X. Lu
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Comment on “A simple approach to determine five thermomechanical properties of thin ductile films on an elastic substrate” [ Appl. Phys. Lett. 85, 6173 (2004) ]

Jürgen Malzbender

Appl. Phys. Lett. 87, 116101 (2005); http://dx.doi.org/10.1063/1.2043227 (1 page) | Cited 1 time

Online Publication Date: 6 September 2005

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65.40.De Thermal expansion; thermomechanical effects
81.40.Ef Cold working, work hardening; annealing, post-deformation annealing, quenching, tempering recovery, and crystallization
68.60.Wm Other nonelectronic physical properties
81.40.Jj Elasticity and anelasticity, stress-strain relations
62.20.F- Deformation and plasticity
81.40.Lm Deformation, plasticity, and creep
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Response to ‘Comment on “A simple approach to determine five thermomechanical properties of thin ductile films on an elastic substrate”’ [ APL (2005) ]

W. M. Huang, Y. Y. Hu, and L. An

Appl. Phys. Lett. 87, 116102 (2005); http://dx.doi.org/10.1063/1.2043228 (1 page)

Online Publication Date: 6 September 2005

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Abstract Unavailable
Show PACS
65.40.De Thermal expansion; thermomechanical effects
68.60.Wm Other nonelectronic physical properties
68.60.Bs Mechanical and acoustical properties
81.40.Jj Elasticity and anelasticity, stress-strain relations
62.20.F- Deformation and plasticity
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