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Applied Physics Letters / Volume 88 / Issue 14 / INTERDISCIPLINARY AND GENERAL PHYSICS

Appl. Phys. Lett. 88, 144101 (2006); doi:10.1063/1.2191743 (3 pages)

Mechanics of a process to assemble microspheres on a patterned electrode

Ting Zhu1, Zhigang Suo1, Adam Winkleman2, and George M. Whitesides2

1Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138
2Department of Chemistry and Chemical Biology, Harvard University, Cambridge, Massachusetts 02138

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(Received 11 December 2005; accepted 15 February 2006; published online 3 April 2006)

A process has been demonstrated recently to assemble microspheres on a patterned electrode under the influence of an applied voltage. Here we examine the mechanics of this process, and describe both the conditions under which excess microspheres jump off the electrode when the voltage is applied, and the forces that attract the remaining microspheres to the desired positions. A quantitative mechanistic understanding of this process rationalizes experimental observations, provides scaling relations, and suggests modifications of the process.

© 2006 American Institute of Physics

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KEYWORDS and PACS

Keywords

gold, polymers, metallic thin films, electrodes, thin film capacitors

PACS

ARTICLE DATA

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http://link.aip.org/link/doi/10.1063/1.2191743

PUBLICATION DATA

ISSN:

0003-6951 (print)  
1077-3118 (online)

Publisher:

$abstract.society.value is a Member of CrossRef American Institute of Physics

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