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Appl. Phys. Lett. 88, 192501 (2006); http://dx.doi.org/10.1063/1.2195781 (3 pages)

Magnetic properties and microstructures of FePt/Ti bilayer films sputter deposited onto glass amorphous substrates

H. Y. Sun1, J. L. Xu1, S. Z. Feng1, Z. F. Su1, J. Hu1, and Y. P. Sun2

1College of Physics Science and Information Engineering, Hebei Normal University, Shijiazhuang 050016, China
2Key Laboratory of Materials Physics, Institute of Solid State Physics, Chinese Academy of Sciences, Hefei 230031, China

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(Received 19 September 2005; accepted 8 March 2006; published online 8 May 2006)

FePt/Ti granular films were fabricated onto glass amorphous substrates using a dc facing-target magnetron sputtering system at various Ti underlayer thickness, then annealed at temperature Ta ranging from 200 to 700 °C. In the FePt (30 nm)/Ti (1 nm) film annealed at 600 °C, the coercivity about 12 kOe is obtained. The results of x-ray diffraction indicate that a ternary FePtTi alloy is formed. Thus, the formation of the ternary FePtTi alloy is considered to play an important role in magnetic properties.

© 2006 American Institute of Physics

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KEYWORDS and PACS

PACS

  • 75.70.Cn

    Magnetic properties of interfaces (multilayers, superlattices, heterostructures)

  • 81.40.Gh

    Other heat and thermomechanical treatments

  • 81.40.Rs

    Electrical and magnetic properties related to treatment conditions

  • 75.60.Ej

    Magnetization curves, hysteresis, Barkhausen and related effects

ARTICLE DATA

PUBLICATION DATA

ISSN

0003-6951 (print)  
1077-3118 (online)

For access to fully linked references, you need to log in.
    M. Yu, Y. Liu, and D. J. Sellmyer, J. Appl. Phys. 87, 6959 (2000)JAPIAU000087000009006959000001.

    K. Sato and Y. Hirotsu, J. Appl. Phys. 93, 6291 (2003)JAPIAU000093000010006291000001.

    Y. Zhang, J. Wan, V. Skumryev, S. Stoyanov, Y. Huang, and G. C. Hadjipanayis, Appl. Phys. Lett. 85, 5343 (2004)APPLAB000085000022005343000001.

    C. H. Lai, C. C. Chiang, and C. H. Yang, J. Appl. Phys. 97, 10H310 (2005)JAPIAU00009700001010H310000001.

    T. Seki, T. Shima, K. Takanashi, Y. Takahashi, and E. Matsubara, Appl. Phys. Lett. 82, 2461 (2003)APPLAB000082000015002461000001.

    M. L. Yan, Y. F. Xu, X. Z. Li, and D. J. Sellmyer, J. Appl. Phys. 97, 10H309 (2005)JAPIAU00009700001010H309000001.

    J. Wan, Y. Huang, Y. Zhang, M. J. Bonder, G. C. Hadjipanayis, and D. Weller, J. Appl. Phys. 97, 10J121 (2005)JAPIAU00009700001010J121000001.

    H. Kura and T. Sato, J. Appl. Phys. 96, 5771 (2004)JAPIAU000096000010005771000001.

    T. Maeda, T. Kai, A. Kikisu, T. Nagase, and J. Akiyama, Appl. Phys. Lett. 80, 2147 (2002)APPLAB000080000012002147000001.

    C. P. Luo and D. J. Sellmeyer, Appl. Phys. Lett. 75, 3162 (1999)APPLAB000075000020003162000001.

    D. Ravelosona, C. Chappert, V. Mathet, and H. Bernas, J. Appl. Phys. 87, 5771 (2000)JAPIAU000087000009005771000001.

    C. H. Lai, C. H. Yang, and C. C. Chiang, Appl. Phys. Lett. 83, 4550 (2003)APPLAB000083000022004550000001.


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