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Appl. Phys. Lett. 92, 152106 (2008); http://dx.doi.org/10.1063/1.2912034 (3 pages)

Highly reproducible fabrication of back-gated GaAs/AlGaAs heterostructures using AuGeNi ohmic contacts with initial Ni layer

Arnaud Valeille1, Koji Muraki1, and Yoshiro Hirayama1,2

1NTT Basic Research Laboratories, NTT Corporation, 3-1 Morinosato-Wakamiya, Atsugi 243-0198, Japan
2SORST-JST, 4-1-8 Honmachi, Kawaguchi 331-0012, Japan

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(Received 5 March 2008; accepted 31 March 2008; published online 15 April 2008)

We show for back-gated GaAs/AlxGa1−xAs heterostructures that a thin Ni layer deposited prior to the standard AuGeNi Ohmic contacts dramatically improves the device yield by keeping the annealed contacts from reaching the back gate 1.2 μm below the channel. A systematic investigation of the contact resistance and the back-gate characteristics as a function of the initial Ni layer thickness and the annealing temperature demonstrates that back-gated structures with contact resistance below 100 Ω can be obtained with a high yield of 90%.

© 2008 American Institute of Physics

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KEYWORDS and PACS

PACS

  • 73.40.Ns

    Metal-nonmetal contacts

  • 61.72.Cc

    Kinetics of defect formation and annealing

ARTICLE DATA

PUBLICATION DATA

ISSN

0003-6951 (print)  
1077-3118 (online)

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