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Applied Physics Letters / Volume 92 / Issue 8 / NANOSCALE SCIENCE AND DESIGN

Appl. Phys. Lett. 92, 083109 (2008); doi:10.1063/1.2839434 (3 pages)

A generic approach to nanocables via nanochannel-confined sequential electrodeposition

Dachi Yang, Guowen Meng, Qiaoling Xu, Xianglong Zhao, Jianxiong Liu, Mingguang Kong, Zhaoqin Chu, Xiaoguang Zhu, and Lide Zhang

Key Laboratory of Materials Physics and Anhui Key Laboratory of Nanomaterials and Nanostructures, Institute of Solid State Physics, Chinese Academy of Sciences, Hefei 230031, People’s Republic of China

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(Received 1 November 2007; accepted 14 January 2008; published online 28 February 2008)

We have exploited a generic method for nanocables, consisting of two materials that can be obtained via electrodeposition, by first electrodepositing the cable “shells” on the interior walls of nanochannels inside anodic aluminum oxide template with one planar surface side coated with a thin meshlike Au layer and then filling the cavities inside the shells by electrodeposition again to achieve the cable “cores.” The method has been demonstrated for the nanocables of Cu-Bi (Cu shell and Bi core) and Bi-Cu (Bi shell and Cu core). Nanocables of other two materials with tunable shell thickness and inner core diameter can be achieved by modulating the Au-layer thickness, and might have potential in the future nanotechnology.

© 2008 American Institute of Physics

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KEYWORDS and PACS

Keywords

bismuth compounds, copper compounds, electrodeposition, nanostructured materials, nanotechnology

PACS

  • 61.46.-w

    Structure of nanoscale materials

  • 82.45.Qr

    Electrodeposition and electrodissolution

ARTICLE DATA

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http://link.aip.org/link/doi/10.1063/1.2839434

PUBLICATION DATA

ISSN:

0003-6951 (print)  
1077-3118 (online)

Publisher:

$abstract.society.value is a Member of CrossRef American Institute of Physics

For access to fully linked references, you need to log in.
    B.-K. Kim, J.-J. Kim, J.-O. Lee, K. Kong, H. J. Seo, and C. J. Lee, Phys. Rev. B 71, 153313 (2005).

    C. Liu, R. W. Li, A. Belik, D. Golberg, Y. Bando, and H. M. Cheng, Appl. Phys. Lett. 88, 043105 (2006)APPLAB000088000004043105000001.


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