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Appl. Phys. Lett. 94, 161109 (2009); doi:10.1063/1.3119321 (3 pages)
Defect reduction in (11
2) semipolar GaN grown on m-plane sapphire using ScN interlayers
(Received 4 February 2009; accepted 25 March 2009; published online 22 April 2009)
2) semipolar GaN grown on m-plane sapphire was studied by transmission electron microscopy. The interlayers comprised Sc metal deposited on a GaN seedlayer that was nitrided before GaN overgrowth by metal-organic vapor-phase epitaxy. Both interlayer thicknesses reduced the dislocation density by a factor of 100 to low-108 cm−2. The 8.5 nm interlayer produced regions that were free from basal plane stacking faults (BSF) and dislocations. The overall BSF density here was reduced by a factor of 5, to (6.49±0.07)×104 cm−1, without the need for an ex situ mask patterning step.© 2009 American Institute of Physics
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KEYWORDS and PACS
Keywords
dislocation density, gallium compounds, III-V semiconductors, masks, MOCVD, multilayers, sapphire, scandium compounds, semiconductor growth, stacking faults, transmission electron microscopy, vapour phase epitaxial growth, wide band gap semiconductors
PACS
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Multilayers
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Direct observation of dislocations and other defects (etch pits, decoration, electron microscopy, x-ray topography, etc.)
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Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, ALD, etc.)
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Vapor phase epitaxy; growth from vapor phase
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Stacking faults and other planar or extended defects
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