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Appl. Phys. Lett. 96, 261102 (2010); http://dx.doi.org/10.1063/1.3455104 (3 pages)

Free-standing AlxGa1−xAs heterostructures by gas-phase etching of germanium

Garrett D. Cole1, Yu Bai2, Markus Aspelmeyer1, and Eugene A. Fitzgerald2

1Fakultät für Physik, Universität Wien, Boltzmanngasse 5, A-1090 Vienna, Austria
2Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA

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(Received 11 April 2010; accepted 25 May 2010; published online 28 June 2010)

We outline a facile fabrication technique for the realization of free-standing AlxGa1−xAs heterostructures of arbitrary aluminum content. Utilizing xenon difluoride (XeF2) we rapidly and selectively remove a sacrificial germanium (Ge) underlayer in a room temperature gas-phase etching procedure. We demonstrate two possibilities for exploiting this unique process: (1) bulk micromachining of a suspended high-frequency low-dissipation micro-optomechanical resonator consisting of an epitaxial GaAs/AlAs multilayer grown on a Ge substrate and (2) epitaxial lift-off of a GaAs film via removal of an embedded Ge sacrificial layer, resulting in lateral etch rates up to 3 mm/h and a conservative selectivity of ∼ 106.

© 2010 American Institute of Physics

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KEYWORDS and PACS

PACS

  • 81.65.Cf

    Surface cleaning, etching, patterning

  • 81.16.-c

    Methods of micro- and nanofabrication and processing

  • 81.05.Ea

    III-V semiconductors

  • 68.55.ag

    Semiconductors

ARTICLE DATA

PUBLICATION DATA

ISSN

0003-6951 (print)  
1077-3118 (online)

For access to fully linked references, you need to log in.
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