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Appl. Phys. Lett. 96, 262104 (2010); http://dx.doi.org/10.1063/1.3457996 (3 pages)

Bias-induced oxygen adsorption in zinc tin oxide thin film transistors under dynamic stress

Yu-Chun Chen1, Ting-Chang Chang1,2, Hung-Wei Li3, Shih-Ching Chen1, Jin Lu1, Wan-Fang Chung4, Ya-Hsiang Tai5, and Tseung-Yuen Tseng4

1Department of Physics, National Sun Yat-Sen University, Kaohsiung 804, Taiwan
2Center for Nanoscience & Nanotechnology, National Sun Yat-Sen University, Kaohsiung 804, Taiwan
3Department of Photonics, Institute of Electro-Optical Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
4Department of Electronics Engineering, Institute of Electronics, National Chiao Tung University, Hsinchu 300, Taiwan
5Department of Photonics, Display Institute, National Chiao Tung University, Hsinchu 300, Taiwan

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(Received 4 May 2010; accepted 3 June 2010; published online 28 June 2010)

This study investigates the effects of bias-induced oxygen adsorption on the electrical characteristic instability of zinc tin oxide thin film transistors in different ambient oxygen partial pressures. When oxygen pressure is largest, the threshold voltages showed the quickest increase but the slowest recovery during the stress phase and recovery phase, respectively. This finding corresponds to the charge trapping time constant and recovery time constant, which are extracted by fitting the stretched-exponential equation and which exhibit a relationship with oxygen pressure. We suggest that the gate bias reduces the activation energy of oxygen adsorption during gate bias stress.

© 2010 American Institute of Physics

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0003-6951 (print)  
1077-3118 (online)

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