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Appl. Phys. Lett. 96, 262902 (2010); http://dx.doi.org/10.1063/1.3458599 (3 pages)

Effect of electrode configurations on the process-induced imprint behavior of epitaxial Pb(Zr0.52Ti0.48)O3 capacitors

Feng Chen, Xuelian Tan, Zhen Huang, Xiaofeng Xuan, and Wenbin Wu

Hefei National Laboratory for Physical Sciences at Microscale, University of Science and Technology of China, Hefei 230026, People's Republic of China

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(Received 16 April 2010; accepted 7 June 2010; published online 28 June 2010)

By using La0.7Sr0.3MnO3 (L) and SrRuO3 (S) electrodes, epitaxial Pb(Zr0.52Ti0.48)O3 (PZT) capacitors with different electrode configurations, i.e., L/PZT/L (from top to bottom) (a), S/PZT/S (b), S/PZT/L (c), and L/PZT/S (d), have been fabricated and the process-induced imprint was investigated. All as-grown capacitors are nearly imprint-free; however, after being annealed at 10−5 Torr of O2 the capacitors a (b) show a large negative (positive) imprinted polarization (P) state at zero electric-field (E), the capacitors c give strongly pinched P-E hysteresis loops, and the capacitors d are highly resistant to imprint failure. We show evidence that the internal fields could be attributed to the various oxygen-loss-related strain gradients at PZT top and bottom interfaces, induced during the annealing.

© 2010 American Institute of Physics

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KEYWORDS and PACS

PACS

  • 84.32.Tt

    Capacitors

  • 85.50.-n

    Dielectric, ferroelectric, and piezoelectric devices

  • 77.80.Dj

    Domain structure; hysteresis

  • 61.72.Cc

    Kinetics of defect formation and annealing

  • 77.22.Ej

    Polarization and depolarization

ARTICLE DATA

PUBLICATION DATA

ISSN

0003-6951 (print)  
1077-3118 (online)

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