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Appl. Phys. Lett. 96, 093116 (2010); http://dx.doi.org/10.1063/1.3353987 (3 pages)

As doping of Si-based low-dimensional systems

F. Ruffino1,2, M. V. Tomasello3, M. Miritello2, G. Nicotra4, C. Spinella4, and M. G. Grimaldi1,2

1Dipartimento di Fisica e Astronomia, Università di Catania, via S. Sofia 64, I-95123 Catania, Italy
2CNR-IMM MATIS, via S. Sofia 64, I-95123, Catania, Italy
3Scuola Superiore di Catania, Via San Nullo 5/i, 95123 Catania, Italy
4Consiglio Nazionale delle Ricerche-Istituto per la Microelettronica e Microsistemi (CNR-IMM), VIII Strada 5, I-95121 Catania, Italy

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(Received 27 January 2010; accepted 13 February 2010; published online 5 March 2010)

In this work we studied the As redistribution in SiO2(70 nm)/Si(30 nm)/SiO2(70 nm) multilayer during postimplantation annealing. By Rutherford backscattering spectrometry and Z-contrast transmission electron microscopy we found an As accumulation at the Si/SiO2 interfaces and at the Si grain boundaries with no segregation of the As in the Si layer. Such an effect could be qualitatively in agreement with a model that assumes a traps distribution into the Si in the first 2–3 nm above the SiO2/Si interfaces and along the Si grain boundaries. In particular, the traps concentration at the Si/SiO2 interfaces was estimated in 1014 traps/cm2.

© 2010 American Institute of Physics

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KEYWORDS and PACS

PACS

  • 61.72.U-

    Doping and impurity implantation

  • 85.40.Ry

    Impurity doping, diffusion and ion implantation technology

  • 68.65.Ac

    Multilayers

  • 61.72.Cc

    Kinetics of defect formation and annealing

  • 61.72.Mm

    Grain and twin boundaries

ARTICLE DATA

PUBLICATION DATA

ISSN

0003-6951 (print)  
1077-3118 (online)

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