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Applied Physics Letters / Volume 97 / Issue 5 / BIOPHYSICS AND BIO-INSPIRED SYSTEMS

Appl. Phys. Lett. 97, 053701 (2010); http://dx.doi.org/10.1063/1.3464553 (3 pages)

Effect of fibril shape on adhesive properties

Daniel Soto1, Ginel Hill1, Aaron Parness2, Noé Esparza2, Mark Cutkosky2, and Tom Kenny2

1Department of Applied Physics, Stanford University, Stanford, California 94305, USA
2Department of Mechanical Engineering, Stanford University, Stanford, California 94305, USA

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(Received 17 March 2010; accepted 25 June 2010; published online 2 August 2010)

Research into the gecko’s adhesive system revealed a unique architecture for adhesives using tiny hairs. By using a stiff material (β-keratin) to create a highly structured adhesive, the gecko’s system demonstrates properties not seen in traditional pressure-sensitive adhesives which use a soft, unstructured planar layer. In contrast to pressure sensitive adhesives, the gecko adhesive displays frictional adhesion, in which increased shear force allows it to withstand higher normal loads. Synthetic fibrillar adhesives have been fabricated but not all demonstrate this frictional adhesion property. Here we report the dual-axis force testing of single silicone rubber pillars from synthetic adhesive arrays. We find that the shape of the adhesive pillar dictates whether frictional adhesion or pressure-sensitive behavior is observed. This work suggests that both types of behavior can be achieved with structures much larger than gecko terminal structures. It also indicates that subtle differences in the shape of these pillars can significantly influence their properties.

© 2010 American Institute of Physics

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KEYWORDS and PACS

Keywords

adhesion, adhesives, friction, polymer fibres

PACS

ARTICLE DATA

Digital Object Identifier
http://dx.doi.org/10.1063/1.3464553

PUBLICATION DATA

ISSN

0003-6951 (print)  
1077-3118 (online)

Publisher

$abstract.society.value is a Member of CrossRef American Institute of Physics

For access to fully linked references, you need to log in.
    J. Lee, R. S. Fearing, and K. Komvopoulos, Appl. Phys. Lett. 93, 191910 (2008)APPLAB000093000019191910000001.

    B. Chui, T. Kenny, H. Mamin, B. Terris, and D. Rugar, Appl. Phys. Lett. 72, 1388 (1998)APPLAB000072000011001388000001.

    N. Glassmaker and C. -Y. Hui, J. Appl. Phys. 96, 3429 (2004)JAPIAU000096000006003429000001.


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