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18 Apr 2011

Volume 98, Issue 16, Articles (16xxxx)

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Appl. Phys. Lett. 98, 163701 (2011); http://dx.doi.org/10.1063/1.3579156 (3 pages)

Thomas Jetzfellner, Amir Rosenthal, K.-H. Englmeier, Alexander Dima, Miguel Ángel Araque Caballero, Daniel Razansky, and Vasilis Ntziachristos
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Low-voltage, high-efficiency nondoped phosphorescent organic light-emitting devices with double-quantum-well structure

Shumei Liu, Bin Li, Liming Zhang, and Shumei Yue

Appl. Phys. Lett. 98, 163301 (2011); http://dx.doi.org/10.1063/1.3581216 (3 pages) | Cited 6 times

Online Publication Date: 18 April 2011

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Low-voltage and high-efficiency nondoped phosphorescent organic light-emitting devices are fabricated by introducing a simple triplet double-quantum-well structure with an Ir(III) complex as potential well layer (PWL) and emitting layer (EML). The effects of various potential barrier layer (PBL) on device performances are discussed. Remarkably, the device with 1,3,5-tris(N-phenyl-benzimidazol-2-yl)benzene (TPBi) as PBL shows a low turn-on voltage of 2.30 V, a maximum power efficiency of 30.5 lm/W at 2.65 V and 24.5 lm/W with 1000 cd/m2 at 3.75 V. We attribute these to the efficient carrier/exciton confinement function of TPBi and the improvement of carrier injection/balance in PWL/EML by self-balancing effect.
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85.60.Jb Light-emitting devices
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Flip chip lamination to electrically contact organic single crystals on flexible substrates

M. Coll, K. P. Goetz, B. R. Conrad, C. A. Hacker, D. J. Gundlach, C. A. Richter, and O. D. Jurchescu

Appl. Phys. Lett. 98, 163302 (2011); http://dx.doi.org/10.1063/1.3580610 (3 pages)

Online Publication Date: 20 April 2011

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The fabrication of top metal contacts for organic devices represents a challenge and has important consequences for electrical properties of such systems. We report a robust, low-cost and nondestructive printing process, flip chip lamination, to fabricate top contacts on rubrene single crystals. The use of surface chemistry treatments with fluorinated self-assembled monolayers, combined with pliable substrates, and mild nanoimprint conditions, ensures conformal contact between ultrasmooth metal contacts and the organic crystal. Space-charge limited current measurements point to better interfacial electrical properties with the flip chip lamination-fabricated contacts compared to the analog architecture of e-beam evaporated top contacts.
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73.40.Ns Metal-nonmetal contacts
82.65.+r Surface and interface chemistry; heterogeneous catalysis at surfaces
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